Introduction:
The manufacturing industry has long relied on mechanical methods for material removal, including chip formation, abrasion and microchipping. However, situations have arisen where these traditional methods prove unsatisfactory, uneconomical, or impossible. Several challenges have driven alternative approaches. The strength and hardness of certain workpiece materials present obstacles, particularly when materials exceed 400 HB in hardness. These materials resist cutting tools leading to rapid wear and unacceptable production times. Brittle materials like highly heat treated alloys, glass, ceramics and powder metallurgy parts are prone to damage during mechanical operations. Components that are too flexible or slender cannot withstand machining forces. Parts that are difficult to clamp present challenges. Geometric complexity often exceeds conventional capabilities including internal and external profiles or holes with high length to diameter ratios in hard materials. Special surface finish and dimensional tolerance requirements may exist that cannot be obtained otherwise. Temperature rise and residual stresses are often undesirable.These difficulties led to chemical, electrical, laser and high-energy beams as energy sources for material removal. These advanced methods, called nontraditional or unconventional machining, began in the 1940s. Such processes remove material through chemical dissolution, etching, melting, evaporation and hydrodynamic action, sometimes with abrasive particles. A major advantage is efficiency independent of workpiece hardness. When applied properly, advanced processes offer major technical and economic advantages.
Chemical Machining:
Chemical machining (CM) was developed from the observation that chemicals attack and etch most metals, stones and some ceramics. The process uses reagents or etchants like acids and alkaline solutions. CM is the oldest advanced process and has been used in engraving, deburring and producing printed circuit boards and microelectronic devices.Chemical Milling:
In chemical milling, shallow cavities are produced on plates, sheets, forgings, and extrusions for weight reduction. Depths of removal can be as large as 12 millimeters. Selective attack is controlled by removable masking layers or partial immersion. The procedure consists of several steps. If the part has residual stresses, they should be relieved to prevent warping. Surfaces are degreased and cleaned for good masking adhesion and uniform removal. Scale from heat treatment should be removed. Masking material is then applied. Masking with tapes or paints (maskants) is common though elastomers like rubber and neoprene, and plastics including polyvinyl chloride, polyethylene, and polystyrene are also used. The maskant should not react with the reagent. If required, maskant covering regions requiring etching is peeled off by the scribe and peel technique.Exposed surfaces are chemically machined with appropriate etchants. Sodium hydroxide is used for aluminum, hydrochloric and nitric acid solutions for steels, and iron chloride for stainless steels. Temperature control and agitation are important for uniform removal. After machining, parts are washed thoroughly to prevent further reactions. Remaining maskant is removed, and parts are cleaned and inspected. Additional finishing may be performed. This sequence can be repeated for stepped cavities and contours. Chemical milling is used in aerospace for large aircraft components, missile skin panels, and extruded airframe parts. Tank capacities for reagents are as large as 3.7 by 15 meters. The process is also used for microelectronic devices and is referred to as wet etching. Some surface damage may result from preferential etching and intergranular attack. Chemical milling of welded and brazed structures may cause uneven removal. Castings may result in uneven surfaces due to porosity and nonuniformity.
Chemical Blanking:
Chemical blanking is similar to sheet metal blanking except material is removed by chemical dissolution rather than shearing. Applications include burr free etching of printed-circuit boards, decorative panels, thin sheet metal stampings, and complex or small shapes.
Photochemical Blanking:
Photochemical blanking or photoetching modifies chemical milling using photographic techniques on flat thin sheets enabling complex burr free shapes on metals as thin as 0.0025 millimeters. It is sometimes called photochemical machining. The procedure involves several steps. The design is prepared at magnification up to 100 times. A photographic negative is made and reduced to finished size. The reduced negative is called the artwork. The enlarged drawing allows design errors to be reduced by the reduction amount. The sheet blank is coated with photosensitive material (photoresist) by dipping, spraying, spin casting, or roller coating, then dried in an oven. This coating is often called the emulsion. The negative is placed over the coated blank and exposed to ultraviolet light, hardening exposed areas. The blank is developed, dissolving unexposed areas. The blank is immersed in or sprayed with reagent, etching exposed areas. Masking is removed and parts are washed.Applications include fine screens, printed circuit cards, electric motor laminations, flat springs and components for miniaturized systems. Skilled labor is required, but tooling costs are low, the process can be automated, and it is economical for medium to high production volume. Photochemical blanking can make very small parts when traditional dies are difficult to produce and is effective for fragile workpieces. Handling reagents requires precautions against chemical exposure. Disposal of by products is a major drawback though some can be recycled.
Design Considerations for Chemical Machining:
Because the etchant attacks all exposed surfaces avoid sharp corners, deep narrow cavities, severe tapers, folded seams or porous materials. Because etchant attacks vertically and horizontally, undercuts may develop. Tolerances of plus or minus 10% of material thickness can be maintained. To improve production rate, bulk material should be shaped by other processes first. Dimensional variations can occur from size changes in mask pattern due to humidity and temperature, minimized by selecting appropriate media and controlling environment. Product drawings must be translated into a protocol compatible with artwork generation equipment.Electrochemical Machining:
Electrochemical machining (ECM) is the reverse of electroplating. An electrolyte acts as current carrier and high electrolyte movement in the tool workpiece gap typically 0.1 to 0.6 millimeters washes metal ions from the workpiece (anode) before they can plate onto the tool (cathode). The cavity produced is the female mating image of the tool shape. The shaped tool solid or tubular is made of brass, copper, bronze or stainless steel. The electrolyte is a highly conductive inorganic fluid like aqueous sodium nitrate, pumped through passages at 10 to 16 meters per second. A DC power supply from 10 to 25 volts maintains current densities of 20 to 200 amperes per square centimeter.Material removal rate (MRR) for 100% efficiency can be estimated from MRR = CI, where MRR is in mm³/min, I is current in amperes, and C is a material constant in mm³/A-min. For pure metals, C depends on valence, higher valence gives lower C. Machines with current capacities as high as 40,000 amperes and as low as 5 amperes are available. Penetration rate is proportional to current density. MRR typically ranges from 1.5 to 4 mm³ per A-min. Because MRR depends only on ion exchange rate, it is unaffected by strength, hardness or toughness.
Process Capabilities:
The concept was patented in 1929 and developed in the 1950s and 1960s. ECM is used for complex cavities in high strength materials, particularly in aerospace for turbine blades, jet-engine parts, and nozzles. Automotive applications include engine castings and gears, and medical industries use it for components. ECM is used for die sinking and producing small holes. Versions are used for turning, facing, milling, slotting, drilling, trepanning, profiling and producing continuous metal strips and webs. Recent applications include micromachining for electronics.Shaped tube electrolytic machining (STEM) is a modification for drilling small-diameter deep holes in turbine blades. The tool is a titanium tube coated with insulating resin. Holes as small as 0.5 millimeters can be drilled at depth to diameter ratios as high as 300 to 1. ECM leaves a burr free bright surface and can be used for deburring. It causes no thermal damage, and absence of tool forces prevents distortion. There is no tool wear since only hydrogen is generated at the cathode. However mechanical properties should be compared with other methods. ECM systems are available as numerically controlled machining centers with high production rates, flexibility and close tolerances. ECM can be combined with electrical discharge machining (EDM).
Design Considerations:
Because electrolyte erodes sharp profiles, ECM is not suited for sharp square corners or flat bottoms. Controlling electrolyte flow may be difficult, so irregular cavities may not achieve desired accuracy. Designs should provide a small taper for holes and cavities.Pulsed Electrochemical Machining:
Pulsed ECM (PECM) uses very high current densities on the order of 1 A/mm², but pulsed rather than direct current. Pulsing eliminates the need for high electrolyte flow rates, which limit ECM in die and mold making (die sinking). PECM improves fatigue life and has been proposed for eliminating recast layer left by EDM. Tolerances typically range from 20 to 100 micrometers. Machines can perform both EDM and PECM. However, maintaining precise alignment is difficult; if misaligned, polishing occurs where gap is smallest and passivation where gap is largest. The process leaves metal residues harmful to the environment if discarded untreated. ECM can be effective for micromachining; absence of tool wear allows precision electronic components though stray current erosion must be overcome.Electrochemical Grinding:
Electrochemical grinding (ECG) combines ECM with conventional grinding. Equipment is similar to a conventional grinder except the wheel is a rotating cathode embedded with abrasive particles. The wheel is metal bonded with diamond or aluminum oxide abrasives and rotates at surface speed from 1,200 to 2,000 m/min. Abrasives serve as insulators between wheel and workpiece and mechanically remove electrolytic products. A flow of electrolyte solution, usually sodium nitrate, is provided. Current densities range from 1 to 3 A/mm². Most metal removal is by electrolytic action; typically less than 5% by abrasive action. Therefore, wheel wear is very low and workpiece remains cool. Finishing cuts are made by grinding action for good finish and accuracy.ECG is suitable for applications similar to milling, grinding and sawing, but not for cavity sinking operations. ECG can be applied to carbides and high strength alloys, offering advantage over traditional diamond wheel grinding for very hard materials. ECG machines are available with numerical controls. Electrochemical honing combines honing with electrochemical action. Although costly, it is as much as 5 times faster than conventional honing, and tool lasts as much as 10 times longer. Electrochemical honing is used primarily for finishing internal cylindrical surfaces.
Design Considerations:
In addition to ECM guidelines, ECG requires: avoid sharp inside radii. Flat surfaces should be narrower than wheel width.Electrical Discharge Machining:
Electrical discharge machining (EDM), also called electrodischarge or spark-erosion machining, is based on erosion of metals by spark discharges. When current carrying wires touch, an arc is produced and metal is eroded leaving a crater. Though known since electricity's discovery, a machining process was not developed until the 1940s. EDM has become one of the most important production technologies.Principle of Operation:
The basic EDM system consists of a shaped tool (electrode) and workpiece connected to a DC power supply and placed in a dielectric (electrically nonconducting) fluid. When potential difference is high enough, dielectric breaks down and a transient spark discharges, removing a small amount of metal. Capacitor discharge repeats at rates between 200 and 500 kHz with voltages from 50 to 380 V and currents from 0.1 to 500 A. Volume removed per spark is typically from 10⁻⁶ to 10⁻⁴ mm³. EDM can be used on any electrical conductor.Melting point and latent heat of melting determine volume removed per discharge as these increase, MRR decreases. MRR can be estimated from MRR = 4 × 10⁴ / (I × Tw^1.23), where MRR is in mm³/min, I is current in amperes, and Tw is melting point in °C. Workpiece is fixtured in the dielectric tank, movements controlled by numerical control. The gap (overcut) is critical, downward feed is controlled by a servomechanism maintaining constant gap. Hardness, strength and toughness do not influence removal rate. Removal rate and surface roughness increase with increasing current density and decreasing spark frequency.
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